| 摘要 |
An object is to increase the reliability of a semiconductor device which is capable of wireless communication. The semiconductor device includes a plurality of functional circuits as redundant circuits, and each of the plurality of functional circuits includes an antenna and a semiconductor integrated circuit. The plurality of functional circuits is covered with one sealing layer in which a fibrous body is impregnated with resin. Further, the semiconductor integrated circuit is provided with a transmission/reception circuit electrically connected to the antenna, a power supply circuit electrically connected to the transmission/reception circuit, and a logic circuit electrically connected to the transmission/reception circuit and the power supply circuit. |
