发明名称 Light emitting device package structure and fabricating method thereof
摘要 A light emitting device package structure is described. The light emitting device package structure includes a substrate serving as a carrier supporting a light emitting device chip. The substrate and the light emitting device chip have a chip side and a substrate side separately. A first electrode layer is disposed on a first surface of the light emitting device chip and a second electrode layer is disposed on a second surface of the light emitting device chip, in which the first surface and the second surface are not coplanar. A first conductive trace is electrically connected to the first electrode layer and a second conductive trace is electrically connected to the second electrode layer. At least the first conductive trace or the second conductive trace is formed along the chip side and the substrate side simultaneously.
申请公布号 US8431950(B2) 申请公布日期 2013.04.30
申请号 US20090471255 申请日期 2009.05.22
申请人 TSAI CHIA-LUN;NI CHING-YU;CHIEN WEN-CHENG;WU SHANG-YI;CHOU CHENG-TE 发明人 TSAI CHIA-LUN;NI CHING-YU;CHIEN WEN-CHENG;WU SHANG-YI;CHOU CHENG-TE
分类号 H01L33/00;H01L21/00;H01L33/38;H01L33/62;H01L33/64 主分类号 H01L33/00
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