发明名称 Cooling device
摘要 When the side of a surface of the board on which the device to be cooled is mounted is defined as the upper side while the side of the other surface is defined as the lower side in a substantially vertical direction to the board, a cooling device includes a heat receiving portion arranged on the upper side the device to be cooled for performing heat exchange with the device to be cooled; a columnar portion standing substantially perpendicularly on the board; a base having a through hole which the columnar portion passes through, and arranged on the upper side of the heat receiving portion; and biasing means for biasing the base along the columnar portion to thereby press the heat receiving portion against the device to be cooled.
申请公布号 US8432695(B2) 申请公布日期 2013.04.30
申请号 US20070441811 申请日期 2007.09.04
申请人 YOSHIKAWA MINORU;NEC CORPORATION 发明人 YOSHIKAWA MINORU
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址