| 摘要 |
PURPOSE: A method for coating heat-resistant glass for a semiconductor process and the heat-resistant glass coated by the same are provided to prevent the separation of a coating layer due to the difference of a thermal expansion coefficient by laminating complex oxide between the heat resistant glass and the coating layer as a buffer layer. CONSTITUTION: Heat-resistant glass is prepared. A buffer layer is coated on the heat-resistant glass. A plasma-resistant layer is coated on the coated buffer layer. The buffer layer is made of complex oxide. The plasma-resistant layer is processed with a thermal spray coating. [Reference numerals] (AA) Preparing heat-resistant glass; (BB) Coating a buffer layer; (CC) Coating a plasma-resistant layer |
