发明名称 |
SUBSTRATE PROCESSING APPARATUS, METHOD FOR TRANSPORTING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PROCESSING SUBSTRATE, METHOD FOR APPLYING DUMMY SUBSTRATE IN THE SUBSTRATE PROCESSING APPARATUS |
摘要 |
<p>PURPOSE: A substrate processing apparatus, a substrate transferring method, a semiconductor device manufacturing method, a substrate processing method, and a method for applying a dummy substrate in the substrate processing apparatus are provided to improve the use efficiency of the dummy substrate by reducing the number of the used dummy substrates. CONSTITUTION: A plurality of processing chambers process a preset number of various substrates. A control unit(239) determines the number of dummy substrates. The control unit divides the substrate in each processing chamber and compares the thickness of a deposition layer in each processing chamber. The control unit transfers the dummy substrate to the processing chamber with the deposition layer of a thin thickness.</p> |
申请公布号 |
KR20130043055(A) |
申请公布日期 |
2013.04.29 |
申请号 |
KR20120098157 |
申请日期 |
2012.09.05 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
KOTANI HIROSHI;IIDA TSUKASA;MIZUGUCHI YASUHIRO;SATO TAKEO;NAKAGAWA YOSHIHIKO;HOSOKAWA RISA |
分类号 |
H01L21/677;H01L21/02 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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