MANUFACTURING METHOD FOR A FLEXIBLE PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a flexible printed circuit board is provided to reduce manufacturing costs by attaching a coverlay film with a thin thickness. CONSTITUTION: A partial coverlay film is attached to a circuit pattern region(S20). The partial coverlay film is pressurized by heat(S30). An unnecessary part of the partial coverlay film is exposed(S40). An exposure pattern region is formed by developing the unnecessary part of the partial coverlay film(S50). The partial coverlay film is dried by irradiating ultraviolet rays to the partial coverlay film(S60). [Reference numerals] (AA) High-temperature drying process; (S10) Coverlay partial blanking step; (S20) Coverlay film attaching step; (S30) Thermal compression step; (S40) Light exposure step; (S50) Development step; (S60) UV irradiation step;