| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus which is used to form the film of a processing liquid on the surface of a substrate to be processed, and can uniformly apply the processing liquid to the whole surface of the substrate; and to provide a coating film formation method thereof. SOLUTION: A coating film formation apparatus 107 comprises a nozzle 20 having a slit-type discharge port 21 extending in the widthwise direction of a substrate G to be processed, a processing liquid supply means 51 which supplies a processing liquid to the nozzle 20, and a nozzle moving means 50 which moves the nozzle 20 along the surface of the substrate G. The coating film formation apparatus 107 forms a film of the processing liquid on the surface of the substrate G by applying the processing liquid through the discharge port 21 of the nozzle 20. Processing liquid spread suppressing means 20d which suppress flow of the processing liquid are provided on the right and left sides of the discharge port 21 in the longitudinal direction. COPYRIGHT: (C)2006,JPO&NCIPI |
