| 摘要 |
PURPOSE: A package of an electronic device including a connection bump, an electronic system, and a manufacturing method thereof are provided to prevent a nonconductive bonding layer from remaining by inducing an inclined surface on the upper side of the connection bump. CONSTITUTION: A substrate(100) includes a connection contact part(120). A step induction layer(130) covers the substrate to expose the connection contact part and includes an insulation layer. A connection bump(140) is connected to the connection contact part. The connection bump includes an inclined surface by a step induced by the step induction layer. |
