发明名称 LAYOUT FOR SEALING AND THERMAL ACCOMMODATION IN LED-DEVICES
摘要 FIELD: electricity.SUBSTANCE: light device on light diodes (LED) comprises a circuit board, a LED-device on it with a primary lens and an element of a secondary lens arranged above and at least partially resting against the primary lens. The element of the secondary lens includes a part of the lens and a flange around it, and is movable in response to adjacency of lenses due to thermal expansion of the primary lens in process of operation. Also the device comprises a cover having a hole balanced with a light path and fixing the secondary lens element above the LED-device and an elastic element of a gasket between the cover and the flange. The cover presses the elastic element of the gasket and the flange of the secondary lens element to the circuit board. The elastic element of the gasket provides for displacement of the secondary lens element caused by thermal expansion of the primary lens during operation.EFFECT: preservation of device operation stability.20 cl, 3 dwg
申请公布号 RU2480669(C2) 申请公布日期 2013.04.27
申请号 RU20090144976 申请日期 2008.04.30
申请人 RUUD LAJTING, INK. 发明人 UILKOKS KURT S.;VAL'CHAK STIV R.;GILLIEN UEHJN
分类号 F21S4/00 主分类号 F21S4/00
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