| 摘要 |
<p>PURPOSE: A semiconductor stack package and a manufacturing method thereof are provided to improve adhesion force by injecting an underfill material into a space between chips. CONSTITUTION: At least one unit package(140) is laminated on a package substrate. An underfill(160) is arranged in a space between unit packages. A bump(144) is formed in one surface of a semiconductor chip. The bump is connected to an inner wire. A mold(146) includes a through-via hole.</p> |
