MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A multi-chip package and a method for manufacturing the same are provided to improve the electrical connection reliability of a wire by mounting a nail-head bonding bump on a stud bump. CONSTITUTION: A second semiconductor chip is laminated on a first semiconductor chip. A first stud bump(124) is formed on a first bonding pad. A first nail-head bonding bump(126) is formed on the first stud bump. A second stud bump(134) is formed on a second bonding pad. A first conductive wire is connected to the second stud bump.