发明名称 |
Manufacturing method of semiconductor device, and IC card, IC tag, RFID, transponder, bill, securities, passport, electronic apparatus, bag, and garment |
摘要 |
The present invention provides a manufacturing method of a semiconductor device used as an ID chip, by which data can be written with improved throughput. According to the manufacturing method of a semiconductor device having a modulation circuit, a demodulation circuit, a logic circuit, a memory circuit, and an antenna circuit over an insulating substrate, the memory circuit is a nonvolatile memory circuit of which data is written in the manufacture of the semiconductor device, and elements in a data portion are formed by electron beam exposure or laser exposure while the other portions are formed by mirror projection exposure, step and repeat exposure, or step and scan exposure. |
申请公布号 |
KR101258671(B1) |
申请公布日期 |
2013.04.26 |
申请号 |
KR20067018171 |
申请日期 |
2005.02.15 |
申请人 |
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发明人 |
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分类号 |
G03F7/20;G06K19/07;G06K19/077;G06K19/10;H01L21/027;H01L21/77;H01L21/8229;H01L21/8246;H01L21/84;H01L23/522;H01L27/10;H01L27/112;H01L27/12;H01L27/13;H01L29/786 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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