发明名称 Adhesives of Improved Electrical and Thermal Conductivities and Method of Using the Same
摘要 PURPOSE: A functional adhesive composition and a use method thereof are provided to prevent dropping of adhesive binder content and reduce content of silver corpuscle and remarkably increase thermal conductance and electric conductance. CONSTITUTION: A functional adhesive composition comprises an adhesive binder which can be used for adhesion of electronic product, silver particles which gives electric conductance and thermal conductance to the adhesive, and a hardener needed for solidifying the adhesive binder. The silver corpuscle uses rod-like particles and increases dispersibility of the silver corpuscles in manufacturing of the adhesive and includes graphene which works as a heat source.
申请公布号 KR101258441(B1) 申请公布日期 2013.04.26
申请号 KR20110004155 申请日期 2011.01.14
申请人 发明人
分类号 B05D3/06;C09J5/00;C09J9/02;C09J11/04 主分类号 B05D3/06
代理机构 代理人
主权项
地址