发明名称 SEMICONDUCTOR LASER MODULE FOR DIRECT DRAWING EXPOSURE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To facilitate adjustment by separating an adjustment mechanism in an optical axis direction of a semiconductor laser module and an adjustment mechanism in a direction orthogonal to an optical axis and arranging the adjusted semiconductor laser modules in an array shape. <P>SOLUTION: A semiconductor laser module comprises a semiconductor laser 11, an LD fixing holder 12 in which an inner diameter of a tubular part is formed larger than an LD outer diameter for a position adjustment of the semiconductor laser 11, an LD fixing cap 13 in which an inner diameter of an adjustment space part is formed larger than an LD pedestal outer diameter for the position adjustment of the semiconductor laser and in which a plurality of through holes into which LD adjusting pins are inserted are provided, an aspherical lens 21 which makes laser light into parallel light, an aspherical lens fixing sleeve 22 including a tapered part and a cylindrical sleeve part for holding the aspherical lens 21 therebetween while matching center lines, and an aspherical lens holder 23 which includes a cylindrical tube part to be inserted into an opening of the LD fixing holder 12 and in which a fitting part for holding the aspherical lens fixing sleeve 22 is included inside the cylindrical tube part. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013077768(A) 申请公布日期 2013.04.25
申请号 JP20110217932 申请日期 2011.09.30
申请人 HITACHI VIA MECHANICS LTD 发明人 SAIKI KOICHI;ASHIKAWA HIDEKI
分类号 H01S5/022;G03F7/20 主分类号 H01S5/022
代理机构 代理人
主权项
地址