| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress point exfoliation which possibly occurs on an adhesive member 4 having a photocurable resin 43 and an inorganic particle 44 dispersed in the photocurable resin 43. <P>SOLUTION: In a volume diameter distribution of inorganic particles 44, D<SB POS="POST">50</SB>≥0.5 μm, D<SB POS="POST">90</SB>≤5.0 μm, D<SB POS="POST">90</SB>/T≤0.4, and 5 μm≤T≤40 μm are satisfied, where D<SB POS="POST">50</SB>is a particle diameter at which a cumulative value in the distribution is 50%, D<SB POS="POST">90</SB>is a particle diameter at which a cumulative value in the distribution is 90%, and T is a thickness of an adhesive member 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
