SEMICONDUCTOR DEVICE PACKAGE ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A semiconductor device package assembly increased in production efficiency of semiconductor devices by enabling the number of semiconductor device packages held by a carrier to be increased. A predetermined area of a first housing molded of white-colored resin, which holds a plurality of bent contact, is covered by a second housing molded of black-colored resin, and a plurality of second housings are supported by a secondary molding carrier in high density. A linking portion of each contact and one or both of the first and second housings are integrated by insert molding.