| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve product yield while suppressing an increase in manufacturing costs when manufacturing a lamination type semiconductor device by using a W2W method. <P>SOLUTION: Wafers in which a plurality of semiconductor chips are formed are laminated by m sheets, and then dicing is performed for each semiconductor chip so that a first lamination chip in which semiconductor chips are laminated by m sheets is formed. After the wafers are laminated by n sheets, dicing is performed for each semiconductor chip so that a second lamination chip in which semiconductor chips are laminated by n sheets is formed. Then, according to the number of defective semiconductor chips contained in the first lamination chip, the first lamination chips are classified, and according to the number of defective semiconductor chips contained in the second lamination chip, the second lamination chips are classified. Further, the first lamination chips after classification or second lamination chips after classification are coupled to form a third lamination chip. <P>COPYRIGHT: (C)2013,JPO&INPIT |
