| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a void from occurring in a through hole formed on a glass substrate by eliminating the influence of a bottom shape in the through hole when filling the through hole with a metal. <P>SOLUTION: A method for manufacturing a substrate comprises: a first step of blocking an opening of a through hole 3 by forming a first plated layer 4a on one surface side of a glass substrate 2 on which the through hole 3 is formed; and a second step of depositing a second plated layer 4b from the other surface side of the glass substrate 2 by electrolytic plating performed using the first plated layer 4a. The second step further includes the steps of: evenly flattening a concave hollow of a bottom of the through hole 3; and filling the through hole by depositing the second plated layer 4b on the through hole after evenly flattening the concave hollow. At least the flattening step performs pulse plating which alternately gives a forward current of a positive polarity and a reverse current of a negative polarity as electrolytic plating. <P>COPYRIGHT: (C)2013,JPO&INPIT |
