| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of reducing the time required to end filling of a through hole with metal by electrolytic plating as compared with conventional methods. <P>SOLUTION: A method for manufacturing a substrate comprises: a step A of forming a plating ground layer 7 on a lower surface side a glass substrate 2 in which a through hole 3 is formed; a step B of blocking a lower opening of the through hole 3 by forming a first plated layer 4a on an upper surface side of the glass substrate 2 by electrolytic plating; and a step C of filling the through hole 3 with metal by depositing a second plated layer 4b made of metal in the through hole 3 by electrolytic plating from the upper surface side of the glass substrate 2. The step A forms the plating ground layer 7 from an edge of the lower opening of the through hole 3 to a part of a side wall surface of the through hole 3. The step B blocks the lower opening of the through hole 3 by causing a growth of the first plated layer 4a from a surface of the plating ground layer 7 inside the through hole 3. The step C fills the through hole 3 with plated metal by causing a growth of the second plated layer 4b from a surface of the first plated layer 4a toward the upper opening of the through hole 3 inside the through hole 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
