| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compound for a bond magnet and a bond magnet, having sufficient heat resistance and excellent in fluidity and filling property during molding. <P>SOLUTION: The compound for the bond magnet and the bond magnet are characterized by containing a magnet powder, a polyphenylene sulfide (PPS) resin, and a polyamide (PA) resin, wherein a content ratio of the magnet powder in the compound is 79 to 94.5 wt. %, a content ratio of the PPS resin is 5 to 20 wt. %, and a content ratio of the PA resin is 0.1 to 2 wt. %. <P>COPYRIGHT: (C)2013,JPO&INPIT |
