发明名称 THICK FILM SILVER PASTE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES
摘要 The present invention is directed to an electroconductive silver thick film paste composition comprising Ag, a glass frit and rhodium resinate, Cr2O3 or a mixture thereof all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The paste is particularly useful for forming a tabbing electrode.
申请公布号 US2013099178(A1) 申请公布日期 2013.04.25
申请号 US201213625930 申请日期 2012.09.25
申请人 E I DU PONT DE NEMOURS AND COMPANY;E I DU PONT DE NEMOURS AND COMPANY 发明人 HANG KENNETH WARREN;LIN YU-CHENG;WANG YUELI
分类号 H01B1/22 主分类号 H01B1/22
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