| 摘要 |
Provided is technique for a semiconductor device including a substrate and a tilting plate which is tiltable relatively to the substrate, the technique being capable of effectively suppressing warpage of the tilting plate. The semiconductor device of the present specification includes a substrate and a tilting plate which is tiltable relatively to the substrate. In the semiconductor device, a rib formed of wavelike portions where a plate thickness is substantially uniform is formed on the tilting plate.
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