| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which responds to a request of improving connection reliability with electronic components. <P>SOLUTION: A wiring board 1 includes a metal plate 2, and a wiring layer 5 having a plurality of insulation layers 3 and a conductive layer 4 disposed on the insulation layers 3 and disposed at least on one main surface of the metal plate 2. The insulation layers 3 include a first insulation layer 6 which is provided in contact with the one main surface of the metal plate 2 and has a resin whose thermal expansion coefficient in a plane direction is larger than that of the metal plate 2 as a main component, and a second insulation layer 7 which is laminated on the first insulation layer 6 and has thermal expansion coefficient in a plane direction smaller than that of the metal plate 2. The second insulation layer 7 contains a plurality of interconnected first particles composed of an inorganic insulation material, and a part of the first insulation layer 6 is interposed in a gap of the first particles. A difference in thermal expansion between the wiring layer 5 and the metal plate 2 can be reduced, and connection reliability with electronic components can be improved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
