发明名称 ELECTRICAL CONTACTS TO NANOSTRUCTURED AREAS
摘要 A process is provided for contacting a nanostructured surface. In that process, a substrate is provided having a nanostructured material on a surface, the substrate being conductive and the nanostructured material being coated with an insulating material. A portion of the nanostructured material is at least partially removed. A conductor is deposited on the substrate in such a way that it is in electrical contact with the substrate through the area where the nanostructured material has been at least partially removed.
申请公布号 US2013099345(A1) 申请公布日期 2013.04.25
申请号 US201213622864 申请日期 2012.09.19
申请人 BANDGAP ENGINEERING, INC.;BANDGAP ENGINEERING, INC. 发明人 BLACK MARCIE R.;FORZIATI JOANNE;JURA MICHAEL;MILLER JEFF;MURPHY BRIAN;STANLEY ADAM
分类号 H01L21/285;H01L31/0224 主分类号 H01L21/285
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