发明名称 |
ELECTRICAL CONTACTS TO NANOSTRUCTURED AREAS |
摘要 |
A process is provided for contacting a nanostructured surface. In that process, a substrate is provided having a nanostructured material on a surface, the substrate being conductive and the nanostructured material being coated with an insulating material. A portion of the nanostructured material is at least partially removed. A conductor is deposited on the substrate in such a way that it is in electrical contact with the substrate through the area where the nanostructured material has been at least partially removed.
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申请公布号 |
US2013099345(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201213622864 |
申请日期 |
2012.09.19 |
申请人 |
BANDGAP ENGINEERING, INC.;BANDGAP ENGINEERING, INC. |
发明人 |
BLACK MARCIE R.;FORZIATI JOANNE;JURA MICHAEL;MILLER JEFF;MURPHY BRIAN;STANLEY ADAM |
分类号 |
H01L21/285;H01L31/0224 |
主分类号 |
H01L21/285 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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