| 摘要 |
A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps of forming a protruded portion constituted of the reuse paste, disposing a metallic foil on both sides of a second prepreg to carry out pressurization, heating the second prepreg to cure the second prepreg and the reuse paste, and processing the metallic foil into a wiring pattern.
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