发明名称 |
Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assemblies |
摘要 |
An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer. |
申请公布号 |
US2013101250(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201213656528 |
申请日期 |
2012.10.19 |
申请人 |
DESAI KISHOR;KACHRU RAVINDER;PATEL VIPULKUMAR;DAMA BIPIN;SHASTRI KALPENDU;PATHAK SOHAM |
发明人 |
DESAI KISHOR;KACHRU RAVINDER;PATEL VIPULKUMAR;DAMA BIPIN;SHASTRI KALPENDU;PATHAK SOHAM |
分类号 |
G02B6/12;H01L33/52 |
主分类号 |
G02B6/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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