| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer treatment apparatus and a water treatment method in which positional deviation between a rotation center of a wafer in supplying a treatment liquid and a geometrical center of the wafer and a state of supplying a removal liquid can be detected. <P>SOLUTION: A film of a treatment liquid is formed by supplying the treatment liquid onto a wafer which is rotated by a spin chuck in an application processing unit, and the treatment liquid on an edge of the wafer W is removed by supplying a rinse liquid to the edge on the wafer W. Edge cut widths D1-D3 between a position of an outer peripheral part of the wafer rotated by the spin chuck in an edge exposure section and a position of an outer peripheral part of the film on the wafer are detected. On the basis of the detected edge cut widths D1-D3, positional deviation of the center of the wafer held by the spin chuck from a rotation center of the spin chuck in the application processing unit is determined and a state of supplying the rinse liquid using an edge rinse nozzle is determined. <P>COPYRIGHT: (C)2013,JPO&INPIT |
