发明名称 MOLDING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a molding apparatus that can stably mold optical components with excellent appearance and quality by using a simple composition while shortening a molding cycle. <P>SOLUTION: Since heat conduction from a mold space CV to core molds 52, 42 is controlled with heat insulation layers 52c, 42c, the temperature of a melting resin is held, and the transfer face shapes of the core molds 52, 42 can be precisely transferred. In addition, heat of the melting resin is not released, local eccentricity of the heat is restrained to be generated and unevenness of the temperature can be dissolved by quickly dispersing the heat with high heat conduction base materials 52d, 42d. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013075457(A) 申请公布日期 2013.04.25
申请号 JP20110217257 申请日期 2011.09.30
申请人 KONICA MINOLTA ADVANCED LAYERS INC 发明人 OKUMURA YOSHIHIRO
分类号 B29C33/38;B29C45/17;B29C45/73;B29L11/00;G02B3/00 主分类号 B29C33/38
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