发明名称 |
THERMOSETTING RESIN COMPOSITION FOR LASER BEAM MACHINING, CURED PRODUCT, AND PRINTED WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for laser beam machining that excels in laser beam machining, and can obtain a cured product having excellent adhesiveness, solvent resistance, and heat resistance. <P>SOLUTION: The thermosetting resin composition for laser beam machining includes: (A) an epoxy resin that has a polycyclic aromatic hydrocarbon ring; (B) a crosslinkable polyimide resin; (C) a heat-curing catalyst; and (D) an inorganic filler. (B) The crosslinkable polyimide resin desirably includes at least one of a carboxyl group and a phenolic hydroxyl group. Moreover, the mix proportion of (A) the epoxy resin that has a polycyclic aromatic hydrocarbon ring and (B) the crosslinkable polyimide resin is desirably (A):(B) = a proportion from 9:1 to 1:9 by a mass ratio. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013076004(A) |
申请公布日期 |
2013.04.25 |
申请号 |
JP20110217142 |
申请日期 |
2011.09.30 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE& TECHNOLOGY;TAIYO HOLDINGS CO LTD |
发明人 |
SUMIYA TAKENORI;NIINO HIROYUKI;SHIBATA DAISUKE;MURATA KATSUTO;ITOKAWA GEN |
分类号 |
C08G59/20;C08K3/00;C08L63/00;H05K1/03;H05K3/00 |
主分类号 |
C08G59/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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