发明名称 SEMICONDUCTOR DEVICE HAVING STRAIN MATERIAL
摘要 A semiconductor device having strain material is disclosed in a particular embodiment, the semiconductor device includes a first cell including a first gate between a first drain and a first source. The semiconductor device also includes a second cell adjacent to the first cell. The second cell includes a second gate between a second drain and a second source. The semiconductor device further includes a shallow trench isolation area between the first source and the second source. A first amount of strain material over the first source and over the second source is greater than a second amount of strain material over the first drain and over the second drain.
申请公布号 US2013099851(A1) 申请公布日期 2013.04.25
申请号 US201213448786 申请日期 2012.04.17
申请人 YANG HAINING;QUALCOMM INCORPORATED 发明人 YANG HAINING
分类号 H01L27/088;H01L21/02;H01L21/48;H03K17/687 主分类号 H01L27/088
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