Support mounted electrically interconnected die assembly
摘要
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
申请公布号
US2013099392(A1)
申请公布日期
2013.04.25
申请号
US201213456126
申请日期
2012.04.25
申请人
MCELREA SIMON J. S.;ROBINSON MARC E.;ANDREWS, JR. LAWRENCE DOUGLAS;VERTICAL CIRCUITS, INC.
发明人
MCELREA SIMON J. S.;ROBINSON MARC E.;ANDREWS, JR. LAWRENCE DOUGLAS