发明名称 FinFET Device And Method Of Manufacturing Same
摘要 A semiconductor device and method for fabricating a semiconductor device is disclosed. An exemplary semiconductor device includes a substrate including a first dielectric layer disposed over the substrate. The semiconductor device further includes a buffer layer disposed over the substrate and between first and second walls of a trench of the dielectric layer. The semiconductor device further includes an insulator layer disposed over the buffer layer and between the first and second wall of the trench of the dielectric layer. The semiconductor device also includes a second dielectric layer disposed over the first dielectric layer and the insulator layer. Further, the semiconductor device includes a fin structure disposed over the insulator layer and between first and second walls of a trench of the second dielectric layer.
申请公布号 US2013099282(A1) 申请公布日期 2013.04.25
申请号 US201113277669 申请日期 2011.10.20
申请人 CHEN CHI-MING;YU CHUNG-YI;HWANG HO-YUNG DAVID;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHEN CHI-MING;YU CHUNG-YI;HWANG HO-YUNG DAVID
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
代理机构 代理人
主权项
地址