CARRIER FOR FLIP-CHIP SUBSTRATE AND FLIP-CHIP METHOD THEREOF

摘要

PURPOSE: A carrier mounting a flip chip and a flip chip method are provided to maintain the high precision of a flip chip substrate by fixing the flip chip substrate with a bonding method. CONSTITUTION: A main substrate includes a first substrate(101) and a second substrate(102). A bonding layer(103) is located between the first substrate and the second substrate. A plurality of first opening parts(1011) are formed on the first substrate. A plurality of second opening parts(1021) are formed on the second substrate. The first opening parts correspond to the second opening parts. The dimension of the second opening part is smaller than the dimension of the first opening part to expose the bonding layer from the first opening part. Flip chip substrates are maintained by the first opening parts and are fixed by the exposed bonding layer.