THREE-DIMENSIONAL INTEGRATED CIRCUIT LATERAL HEAT DISSIPATION

摘要

PROBLEM TO BE SOLVED: To provide a 3-D integrated circuit lateral heat dissipation.

SOLUTION: By filling an air gap between steps of a stacked IC device with a thermally conductive material, heat generated at one or more locations within one of the steps can be laterally displaced. The lateral displacement of the heat can be along the full length of the step and the thermal material can be electrically insulated. Through silicon-vias (TSVs) can be constructed at certain locations to assist in heat dissipation away from thermally troubled locations.

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