发明名称 HAPTIC FEEDBACK MODULE
摘要 The present invention is directed to a haptic feedback module, which includes a vibration plate, and at least one first actuator that is disposed along a lateral surface of the circumference of the vibration plate. The vibration plate contacts with a top plate member. When the first actuator presses the vibration plate, the vibration energy of the vibration plate is transferred to the top plate member to result in haptic feedback.
申请公布号 US2013100046(A1) 申请公布日期 2013.04.25
申请号 US201113307626 申请日期 2011.11.30
申请人 CHUANG TSI-YU;CHING CHIA-NAN;CHIEF LAND ELECTRONIC CO., LTD. 发明人 CHUANG TSI-YU;CHING CHIA-NAN
分类号 G06F3/041 主分类号 G06F3/041
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