| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of controlling an IC packaged in an IC socket at a desired temperature without using another device and capable of measuring the characteristics of the IC from outside even during temperature control. <P>SOLUTION: An IC socket 51 capable of packaging ICs (integrated circuits) 21-23 includes: a bottom plate part 1 arranged opposite to a bottom part of each of the ICs 21-23 being ICs packaged in the IC socket 51; a cover part 2 arranged on the bottom plate part 1, covering the side part of each of the packaged ICs 21-23 and having an aperture hole 2a for exposing the upper part of each of the packaged ICs 21-23 formed thereon; and first heating/heat absorption parts 3, 4a, 4b, 5a, 5b, 5c each integrated into the bottom plate part 1 and brought into contact with the bottom part of each of the packaged ICs 21-23 to heat/absorb heat of the packaged ICs. <P>COPYRIGHT: (C)2013,JPO&INPIT |
