发明名称 |
Semiconductor Device and Method |
摘要 |
An electrical device includes a semiconductor chip. The semiconductor chip includes a routing line. An insulating layer is arranged over the semiconductor chip. A solder deposit is arranged over the insulating layer. A via extends through an opening of the insulating layer to electrically connect the routing line to the solder deposit. A front edge line portion of the via facing the routing line is substantially straight, has a concave curvature or has a convex curvature of a diameter greater than a maximum lateral dimension of the via. |
申请公布号 |
US2013099383(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201113278681 |
申请日期 |
2011.10.21 |
申请人 |
MEYER-BERG GEORG;BIRZER CHRISTIAN;INFINEON TECHNOLOGIES AG |
发明人 |
MEYER-BERG GEORG;BIRZER CHRISTIAN |
分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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