GLASS SUBSTRATE CUTTING DEVICE, GLASS SUBSTRATE CUTTING METHOD, AND GLASS SUBSTRATE MANUFACTURING METHOD

摘要

[Problem] To provide a glass cutting device capable of cutting a glass substrate even when the force applied in the direction of the thickness of a glass substrate is relatively weak. [Solution] A glass substrate cutting device (100) according to the present solution provides a cutting member (10) for applying force to a main surface (Ga) of a glass substrate (G) having the main surface (Ga) and a main surface (Gb) on which a scribe line (S) has been formed, and a tensile-stress-applying member for applying tensile stress to the glass substrate (G). The cutting member (10) cuts the glass substrate (G) by applying force to the main surface (Ga) of the glass substrate (G) while tensile stress is applied to the glass substrate (G) by the tensile-stress-applying member.