发明名称 |
SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF UPPER SEMICONDUCTOR DEVICES ON A LOWER SEMICONDUCTOR DEVICE |
摘要 |
Semiconductor packages are provided. The semiconductor packages may include an upper package including a plurality of upper semiconductor devices connected to an upper package substrate. The semiconductor packages may also include a lower package including a lower semiconductor device connected to a lower package substrate. The upper and lower packages may be connected to each other.
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申请公布号 |
US2013099373(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201213550921 |
申请日期 |
2012.07.17 |
申请人 |
KWON HEUNG-KYU;KIM YOUNG-BAE;LEE YUN-HEE;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWON HEUNG-KYU;KIM YOUNG-BAE;LEE YUN-HEE |
分类号 |
H01L23/488 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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