发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME |
摘要 |
A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via.
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申请公布号 |
US2013102146(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201213712399 |
申请日期 |
2012.12.12 |
申请人 |
SK HYNIX INC.;SK HYNIX INC. |
发明人 |
BYEON SANG-JIN;CHOI JUN-GI |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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