发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME
摘要 A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via.
申请公布号 US2013102146(A1) 申请公布日期 2013.04.25
申请号 US201213712399 申请日期 2012.12.12
申请人 SK HYNIX INC.;SK HYNIX INC. 发明人 BYEON SANG-JIN;CHOI JUN-GI
分类号 H01L21/768 主分类号 H01L21/768
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