| 摘要 |
The present invention relates to an improved LED backlight module, which is disposed on a main frame installed in a liquid crystal display device, and comprises: a supporting body, a copper circuit layer, a plurality of LED chips, a plurality of extended thermal-conductivity layers, a light guide plate, and a bottom reflecting member. In the present invention, it mainly connects the plurality of extended thermal-conductivity layers to a plurality of the soldering points of the copper circuit layer, and attaches a majority of the extended thermal-conductivity layers to the surface of the bottom plate of the main frame through an insulating and thermal-conductivity adhesive; So that, when the LED chips emit the light, the soldering points conduct the heat produced by the LED chips to the extended thermal-conductivity layers, so as to evenly distribute the heat over the surface of the bottom plate through the extended thermal-conductivity layers.
|
