| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of further downsizing a semiconductor package. <P>SOLUTION: A semiconductor device A1 has: a semiconductor substrate 3 on which at least a part of circuit elements is formed; one or more surface electrodes 41a and 41b arranged on a surface of the semiconductor substrate 3; and a rear face electrode 42 arranged on a rear face of the semiconductor substrate 3 and conducted with the circuit elements. The surface electrodes 41a and 41b are conducted with the circuit elements. The semiconductor device A1 further has: a supporting substrate 1 arranged on the surface side and supporting the semiconductor substrate 3, the surface electrodes 41a and 41b and the rear face electrode 42; and conductive parts 51a and 51b conducted with the surface electrodes 41a and 41b and penetrating through the semiconductor substrate 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
