PHOTOSENSITIVE RESIN COMPOSITION

摘要

Disclosed herein is a photosensitive resin composition, including: a UV-curable resin which can be developed in an aqueous alkali solution; a photopolymerization initiator; an unsaturated ethylene monomer; a thermocuring agent; and a phosphate compound, wherein the phosphate compound is included in an amount of 1 ~ 40 wt% based on a solid content of the composition. The photosensitive resin composition is advantageous in that its cured product has excellent heat resistance and ability to withstand PCT (pressure cooker test) and has improved resolution and flexibility.