USING THREE-DIMENSIONAL REPRESENTATIONS FOR DEFECT-RELATED APPLICATIONS
摘要
<p>A method for determining one or more inspection parameters for a wafer inspection recipe is described. The method comprises the steps of: generating a three-dimensional representation of one or more layers of a wafer based on design data; and determining one or more inspection parameters for a wafer inspection recipe based on the three-dimensional representation. The method is performed by a computer system.</p>
申请公布号
WO2012170477(A3)
申请公布日期
2013.04.25
申请号
WO2012US41019
申请日期
2012.06.06
申请人
KLA-TENCOR CORPORATION;PARK, ALLEN;CHANG, ELLIS;AJI, PRASHANT A.;LANGE, STEVEN, R.
发明人
PARK, ALLEN;CHANG, ELLIS;AJI, PRASHANT A.;LANGE, STEVEN, R.