| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed board excellent in low dielectric property, flame retardancy and solder heat resistance after boiled, and to provide an epoxy resin composition used for the printed board. <P>SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent and a reactive flame retardant, wherein the curing agent is a biphenylene aralkyl-type phenol resin represented by formula (I). A printed wiring board is obtained by using the epoxy resin composition. In formula (I), m represents an integer of 0 to 400; and X<SB POS="POST">1</SB>to X<SB POS="POST">4</SB>each independently represent a hydrogen atom or a 1-10C alkyl group. <P>COPYRIGHT: (C)2013,JPO&INPIT |
