| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal filling apparatus capable of minimizing the thickness of a layer consisting of excess metal formed on a processed workpiece, and filling very small space (a via hole or a through-hole) formed to be opened on the workpiece with a molten metal. <P>SOLUTION: The metal filling apparatus 1 includes: a holding table H for holding a semiconductor wafer; a piston P which is provided oppositely to the holding table H and has a pressing unit made of a metal formed on the side opposite to the holding table H; and a pressing mechanism 5 which can press the piston P against the semiconductor wafer K held on the holding table H, etc. An airtight processing chamber 2 is formed by the semiconductor wafer K held on the holding table H, a housing C and the piston P. The metal filling apparatus further includes: a decompression mechanism 3 which discharges gas in the processing chamber 2 to decompress the inside of the processing chamber 2; a molten metal supply mechanism 4 for supplying the molten metal M in the processing chamber 2; and a pressurized gas supply mechanism 7 for supplying inert gas in the processing chamber 2, etc. <P>COPYRIGHT: (C)2013,JPO&INPIT |
