发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a highly-reliable and high-voltage compound semiconductor device which prevents an electrode material from reaching a boundary between an electrode an a compound semiconductor layer and prevents deterioration in gate characteristics. <P>SOLUTION: A compound semiconductor device comprises: a compound semiconductor laminate structure 2; a passivation film 6 formed on the compound semiconductor laminate structure 2 and having a pass-through opening 6a; and a gate electrode 7 formed on the passivation film 6 so as to fill the pass-through opening 6a. In the gate electrode 7, crystal grain boundaries 101 between crystal arrays different from each other are formed. A starting point of each crystal grain boundary 101 is positioned on a flat surface of the passivation film 6 away from the pass-through opening 6a. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013077620(A) 申请公布日期 2013.04.25
申请号 JP20110215197 申请日期 2011.09.29
申请人 FUJITSU LTD 发明人 OKAMOTO NAOYA;MAKIYAMA KOZO;TAGI TOSHIHIRO;MINOURA YUICHI;OZAKI SHIRO;MIYAJIMA TOYOO
分类号 H01L21/28;H01L21/283;H01L21/338;H01L29/778;H01L29/812;H03F3/21 主分类号 H01L21/28
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