发明名称 |
COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly-reliable and high-voltage compound semiconductor device which prevents an electrode material from reaching a boundary between an electrode an a compound semiconductor layer and prevents deterioration in gate characteristics. <P>SOLUTION: A compound semiconductor device comprises: a compound semiconductor laminate structure 2; a passivation film 6 formed on the compound semiconductor laminate structure 2 and having a pass-through opening 6a; and a gate electrode 7 formed on the passivation film 6 so as to fill the pass-through opening 6a. In the gate electrode 7, crystal grain boundaries 101 between crystal arrays different from each other are formed. A starting point of each crystal grain boundary 101 is positioned on a flat surface of the passivation film 6 away from the pass-through opening 6a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013077620(A) |
申请公布日期 |
2013.04.25 |
申请号 |
JP20110215197 |
申请日期 |
2011.09.29 |
申请人 |
FUJITSU LTD |
发明人 |
OKAMOTO NAOYA;MAKIYAMA KOZO;TAGI TOSHIHIRO;MINOURA YUICHI;OZAKI SHIRO;MIYAJIMA TOYOO |
分类号 |
H01L21/28;H01L21/283;H01L21/338;H01L29/778;H01L29/812;H03F3/21 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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