| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable inhibition of an occurrence of chipping when forming an ohmic electrode by laser annealing. <P>SOLUTION: In a semiconductor device manufacturing method, laser annealing when forming a drain electrode 11 on a rear face 1b side of an n<SP POS="POST">+</SP>type substrate 1 is performed only in a chip and not performed in a dicing region. As a result, because a region where a laser scar is not left is to be diced when performing dicing with a dicing blade 60, dicing can be performed without being affected by the laser scar, thereby to enable inhibition of an occurrence of chipping. <P>COPYRIGHT: (C)2013,JPO&INPIT |
