发明名称 Method for Selective Metallization on a Ceramic Substrate
摘要 A method of selective metallization on a ceramic substrate includes selectively forming an active brazing material on a predetermined area of a surface of a ceramic substrate, attaching the metal layer to the ceramic substrate with the active brazing material, performing a brazing process on the active brazing material, forming an etching stop layer on the metal layer and performing an etching process, and removing the etching stop layer. The method can be applied to a severe environment, and the conchoidal fracture between the ceramic substrate and the metal layer can also be avoided. The present invention not only simplifies the process but also improves the product yield.
申请公布号 US2013098867(A1) 申请公布日期 2013.04.25
申请号 US201113314392 申请日期 2011.12.08
申请人 WEI SHIH-LONG;HSIAO SHEN-LI;HO CHIEN-HUNG;VIKING TECH CORPORATION 发明人 WEI SHIH-LONG;HSIAO SHEN-LI;HO CHIEN-HUNG
分类号 C23F1/00 主分类号 C23F1/00
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