发明名称 SEPARATION DEVICE, SEPARATION SYSTEM AND SEPARATION METHOD
摘要 <p>The invention is a separation device by means of which a polymerized substrate in which a processed substrate and a support substrate are bonded by adhesive is separated into the processed substrate and the support substrate, said separation device comprising: a first holding section that holds the processed substrate in a room temperature state; a second holding section that holds the support substrate in a room temperature state; and a moving mechanism that holds and vertically moves the periphery of the second holding section so that the room-temperature support substrate held by the second support section is continuously separated from the room-temperature processed substrate held by the first holding section, said separation starting from the periphery of said support substrate and progressing toward the central portion thereof.</p>
申请公布号 WO2013058129(A1) 申请公布日期 2013.04.25
申请号 WO2012JP75962 申请日期 2012.10.05
申请人 TOKYO ELECTRON LIMITED;HIRAKAWA, OSAMU;YOSHITAKA, NAOTO;SOMA, YASUTAKA;HONDA, MASARU 发明人 HIRAKAWA, OSAMU;YOSHITAKA, NAOTO;SOMA, YASUTAKA;HONDA, MASARU
分类号 H01L21/02;H01L21/683 主分类号 H01L21/02
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